LTE Cat.4, 3G/HSPA+, GPRS/EDGE, Global, 2x SIM LTE B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B39, B40, B41 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH...
LTE Cat.4, 3G/HSPA+, GPRS/EDGE, Global, 2x SIM LTE B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B39, B40, B41 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH...
Rugged stand-alone metal enclosure with compact external power supply Supports Jumbo Frames (up to 10240 bytes) Multiple mounting options (Desktop, DIN Rail or Wall-mount) Features configurable PoE Reset on Fiber LOS Supports IEEE...
3-slot Butterfly BP for 1U chassis Segments: 1 One CPU card slot PCIe slot: One x16 PCI-X slot: N/A PCI slot: One 32/33 Compatible with IPC chassis: ACP-10103-slot Butterfly BP for 1U chassis...
4 RS-232 series ports extension module by LPC connector on CPU card. Dimensions (L x H): 31.5 x 48 mm (1.24" x 1.88") Support Model: PCE-5029/5031/5032/ 5129/5131/5132/7129/7131/7132; PCE-3029/3032/4129/41324 RS-232 serial ports e...
Global VPN, Multiple LAN/WAN configuration, DIN rail mounting Powerful CPU and Memory, Hosting of SW IoT applications 5x ETH USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °C, Power supply 10 to 60 V DC Certificatio...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
Deliver superior performance in compatibility and functionality Boot times are less than 2 seconds Solidified SPI with a 100% reproducible BIOS image and SPI write protect Storage security with data encryption Boot management prot...
Intel OPS(Open Pluggable Specification) form factor Power by Rockchip RK3399 SOC (Dual-core Cortex-A72 + Quad-core Cortex-A53) LPDDR4-3200 4G plus 64G eMMC on board Expandable via M.2 2230 E key and miniPCIe slot Supports Android ...
包含 SMARC SOM-2569（Intel Atom E3950）和 SOM-DB2500 双通道 LPDDR4 8 GB 内存，板载 eMMC 64 GB 无线模块板载设计，集成双GbE 支持PCIex1, USB3.0, USB2.0, SATA 3.0 支持 Win10 ，WISE-PaaS/DeviceOn 和 iManager API SMARC 2.0开发套件，包括SOM-2569和SOM-DB2500。...