LTE Cat.4, 3G/HSPA+, GPRS/EDGE, Global, 2x SIM LTE B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B39, B40, B41 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH...
Rugged stand-alone metal enclosure with compact external power supply Supports Jumbo Frames (up to 10240 bytes) Multiple mounting options (Desktop, DIN Rail or Wall-mount) Features configurable PoE Reset on Fiber LOS Supports IEEE...
3-slot Butterfly BP for 1U chassis Segments: 1 One CPU card slot PCIe slot: One x16 PCI-X slot: N/A PCI slot: One 32/33 Compatible with IPC chassis: ACP-10103-slot Butterfly BP for 1U chassis...
4 RS-232 series ports extension module by LPC connector on CPU card. Dimensions (L x H): 31.5 x 48 mm (1.24" x 1.88") Support Model: PCE-5029/5031/5032/ 5129/5131/5132/7129/7131/7132; PCE-3029/3032/4129/41324 RS-232 serial ports e...
Global VPN, Multiple LAN/WAN configuration, DIN rail mounting Powerful CPU and Memory, Hosting of SW IoT applications 5x ETH USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °C, Power supply 10 to 60 V DC Certificatio...
2xDB62芯黑色绝缘公头连接器 1x镀锡铜绞带地线线缆 铝/麦拉铝箔包铜双屏蔽电缆 隔离P.V.C套 UL2464认证通过 灰色带DB-62接头的双屏蔽电缆...
重量:240克 68芯SCSI-II 公头连接器双屏蔽电缆 68芯半间距绝缘铜合金镀金公头连接器,拇指螺丝 34双捻镀锡铜绞带地线线缆 铝/麦拉铝箔包铜双屏蔽电缆 P.V.C. 套 UL 2919认证通过 颜色:黑色带SCSI-II 68针公接头的双屏蔽电缆...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
Intel OPS(Open Pluggable Specification) form factor Power by Rockchip RK3399 SOC (Dual-core Cortex-A72 + Quad-core Cortex-A53) LPDDR4-3200 4G plus 64G eMMC on board Expandable via M.2 2230 E key and miniPCIe slot Supports Android ...
260pin SODIMM ECC DIMM 数据传输速率:2133/2400/2666 MT/s 容量:2GB~16GB 原装 IC 芯片 (Samsung/Hynix) 支持 ECC 功能 支持宽温 (-40°C~85°C) 工作研华SQRAM 为工业级 DRAM 内存,采用原装 IC 芯片设计而成,并已通过严格的测试,具有出色的耐用性和品质。SQRAM 通过固定 DIE,可有效保证品质和兼容性,同时为ECC方案提供可选的宽温解决方案。...