Easy, reliable field termination of DB9 cables 9 separate connection points (DB9 connector) Labeled terminal block with set screws Voltage rating: 1000 Vac, 500 Vdc Current rating: 3 AmpsBB-DGB9FT is a convenient way to perform f...
LoRaWAN wireless technology with Less interference with high penetration rate capability Support Modbus/RTU communication protocol Support max. 128 address and 30 rule settings Compact design, suitable for plug and play applicatio...
Super high-speed USB 3.0 data transfer rates (up to 5 Gbps) 10 times faster than USB 2.0 Molded backshell with strain relief for added protection Aluminum-mylar foil with braided shielding USB 3.0 SuperSpeed is the new standard fo...
低成本通用DIN导轨安装螺丝，支持DAQ卡的模块和DB37内连接器的终端模块 外壳尺寸：（宽x长x高）：87.2x112.5x51毫米 （3.4x4.4x2.0英寸） 配合PCI-1713U, PCI-1715U, PCI-1718HDU, PCI-1720U, PCI-1730U, PCI-1733, PCI-1734, PCI-1750, PCI-1760U, PCI-1761一起使用ADAM-3900系列是用各种通用螺丝端子模块组成,这些端子模块用于...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
Supports max. five loops of power input withsingle phase Flexible connection (1P2W, 3P3W, 3P4W..)mode Built-in F-RAM to extend memory life cycle Standard DIN-Rail mounting and compactsize (54 × 65mm) Split-Core transformer support...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
USB to 1x High Speed Serial COM port module Full size Mini PCIe & Module type combo Support High Speed RS232/ RS422/ RS485 portHigh Speed Serial COM iDoor Module...