Super high-speed USB 3.0 data transfer rates (up to 5 Gbps) 10 times faster than USB 2.0 Molded backshell with strain relief for added protection Aluminum-mylar foil with braided shielding USB 3.0 SuperSpeed is the new standard fo...
两个插槽，用于两个 APAX-5000 模块 支持 DIN 导轨和壁挂式安装 所有 APAX I/O 模块均支持热插拔机制 30G抗冲击和2Grms抗振性APAX-5002L 是 CPU 模块、耦合器和 I/O 模块之间的接口。 不同的APAX-5002/5002L可以堆叠在一起。电源和数据可以传输到插入APAX-5002/5002L上的I/O模块。您可以使用APAX-5343E电源模块为背板和I / O模块供电。...
低成本通用DIN导轨安装螺丝，支持DAQ卡的模块和DB37内连接器的终端模块 外壳尺寸：（宽x长x高）：87.2x112.5x51毫米 （3.4x4.4x2.0英寸） 配合PCI-1713U, PCI-1715U, PCI-1718HDU, PCI-1720U, PCI-1730U, PCI-1733, PCI-1734, PCI-1750, PCI-1760U, PCI-1761一起使用ADAM-3900系列是用各种通用螺丝端子模块组成,这些端子模块用于...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
Supports max. five loops of power input withsingle phase Flexible connection (1P2W, 3P3W, 3P4W..)mode Built-in F-RAM to extend memory life cycle Standard DIN-Rail mounting and compactsize (54 × 65mm) Split-Core transformer support...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, EMEA, 2x SIM LTE B1, B3, B7, B8, B20 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
USB to 1x High Speed Serial COM port module Full size Mini PCIe & Module type combo Support High Speed RS232/ RS422/ RS485 portHigh Speed Serial COM iDoor Module...
支持集电极开路输出 额定电压:8 ~ 30 VDC 额定电流:200mA(max负载) 过压保护:+ 40VDC 脉冲输出频率:1 KHz Opto-isolator响应时间:150us(最大) 隔离电压:2000 VDC -40 ~ 70°C宽工作温度...