LTE Cat.4, 3G/HSPA+, GPRS/EDGE, Global, 2x SIM LTE B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B25, B26, B28, B38, B39, B40, B41 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH...
Rugged stand-alone metal enclosure with compact external power supply Supports Jumbo Frames (up to 10240 bytes) Multiple mounting options (Desktop, DIN Rail or Wall-mount) Features configurable PoE Reset on Fiber LOS Supports IEEE...
3-slot Butterfly BP for 1U chassis Segments: 1 One CPU card slot PCIe slot: One x16 PCI-X slot: N/A PCI slot: One 32/33 Compatible with IPC chassis: ACP-10103-slot Butterfly BP for 1U chassis...
4 RS-232 series ports extension module by LPC connector on CPU card. Dimensions (L x H): 31.5 x 48 mm (1.24" x 1.88") Support Model: PCE-5029/5031/5032/ 5129/5131/5132/7129/7131/7132; PCE-3029/3032/4129/41324 RS-232 serial ports e...
Global VPN, Multiple LAN/WAN configuration, DIN rail mounting Powerful CPU and Memory, Hosting of SW IoT applications 5x ETH USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °C, Power supply 10 to 60 V DC Certificatio...
2xDB62芯黑色绝缘公头连接器 1x镀锡铜绞带地线线缆 铝/麦拉铝箔包铜双屏蔽电缆 隔离P.V.C套 UL2464认证通过 灰色带DB-62接头的双屏蔽电缆...
重量:240克 68芯SCSI-II 公头连接器双屏蔽电缆 68芯半间距绝缘铜合金镀金公头连接器,拇指螺丝 34双捻镀锡铜绞带地线线缆 铝/麦拉铝箔包铜双屏蔽电缆 P.V.C. 套 UL 2919认证通过 颜色:黑色带SCSI-II 68针公接头的双屏蔽电缆...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 5x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
LTE cat.3, 3G/HSPA+, GPRS/EDGE, NAM, 2x SIM LTE B2, B4, B5, B13, B17 Powerful CPU and Memory, Hosting of SW IoT applications DIN rail mounting, Sleep mode 2x ETH GPS, USB, I/O 2x DI + 1x DO, MicroSD Operating temp. –40 °C to +75 °...
Intel OPS(Open Pluggable Specification) form factor Power by Rockchip RK3399 SOC (Dual-core Cortex-A72 + Quad-core Cortex-A53) LPDDR4-3200 4G plus 64G eMMC on board Expandable via M.2 2230 E key and miniPCIe slot Supports Android ...
包含 SMARC SOM-2569(Intel Atom E3950)和 SOM-DB2500 双通道 LPDDR4 8 GB 内存,板载 eMMC 64 GB 无线模块板载设计,集成双GbE 支持PCIex1, USB3.0, USB2.0, SATA 3.0 支持 Win10 ,WISE-PaaS/DeviceOn 和 iManager API SMARC 2.0开发套件,包括SOM-2569和SOM-DB2500。...